Condor 300 ensures that bumps, gold bumps, micro bumps and TSV meet their tight dimensional tolerances and are correctly positioned as well as defect controlled.
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The Condor PD Series is targeting post dicing metrology defect inspection at High Volume Manufacturing (HVM). Inspection is conducted while dice are still in wafer format — the last opportunity to add essential information to the wafer map.
Eagle-i s the most advanced system for 2D surface defect inspection and metrology, delivering High volume production 2D inspection solutions for Pre and post-bumped wafers, Probe Mark Inspection, OQc and more.
Designed to manage the most critical issues of LED applications inspection, Condor 5LED includes advanced software alignment functionality.
The Condor 900 is the ideal choice for inspection and metrology addressing the most demanding semiconductor market applications and the emerging 3D-IC market
The Condor 203 is a versatile, fully automated, optical inspection platform for special applications such as LED, MEMS, optical and medical devices, designed to inspect framed or unframed wafers and various thickness.