Condor 300

Condor 300 ensures that bumps, gold bumps, micro bumps and TSV meet their tight dimensional tolerances and are correctly positioned as well as defect controlled.
Condor 300 models report bump coplanarity for each die to ensure reliable flip-chip packaging. In addition, they measure each bump dimensional and placement precision, as well as inspect for surface defects. Dedicated detection engines inspect gold bump surface for pits and nodules.
The system’s patented CTS™ (Camtek Triangulation Sensor) measures solder and gold bump heights at micron-level accuracy and repeatability. The CTS broad, angular coverage obtains a precise, stable measurement from a wide range of bump shapes and materials.
The patented CCS™ (Chromatic Confocal Sensor) is an optional submicron height sensor that provides pinpoint precision to verify critical height dimensions.
The combination of CTS™ capabilities, advanced optics and dedicated inspection algorithms allows the most demanding bumping processes to be critically monitored at high throughput.

Condor 300

System Highlights

  • Innovative image acquisition technology to achieve better detection capabilities.
  • Integrated 3D and 2D metrology and inspection in a single system.
  • A wide selection of sub-micron height sensors from sub-10micron gold and micro bumps to high aspect ratio TSV.
  • Controllable and independent bright field and dark field detection channels and sophisticated algorithms enabling best TPT/Sensitivity envelop of performance.
  • Detects dicing-related damage inside and outside die boundary at unmatched throughput.
  • Automatic defect binning and classification.
  • Best-of-breed setup automation to meet high resolution and productivity requirements of pure-play packaging houses handling hundreds of products.
For additional information on our products, please contact us.
Request Information

More In Camtek Semiconductor

Condor PD

The Condor PD Series is targeting post dicing metrology defect inspection at High Volume Manufacturing (HVM). Inspection is conducted while dice are still in wafer format — the last opportunity to add essential information to the wafer map.


Eagle-i s the most advanced system for 2D surface defect inspection and metrology, delivering High volume production 2D inspection solutions for Pre and post-bumped wafers, Probe Mark Inspection, OQc and more.

Condor 5LED

Designed to manage the most critical issues of LED applications inspection, Condor 5LED includes advanced software alignment functionality.

Condor 900

The Condor 900 is the ideal choice for inspection and metrology addressing the most demanding semiconductor market applications and the emerging 3D-IC market

Condor 203

The Condor 203 is a versatile, fully automated, optical inspection platform for special applications such as LED, MEMS, optical and medical devices, designed to inspect framed or unframed wafers and various thickness.