The fast growing cost-driven LED (Light Emitting Diode) manufacturing industry requires the most reliable inspection tools.
Designed to manage the most critical issues of LED applications inspection, Condor 5LED includes advanced software alignment functionality. This capability enables high precision die alignment – thus ensuring high throughput, reliable detection and low false rate. Using dedicated engines, the system solves the challenging issues of LED inspection caused due to the very small die size, and consequently extremely high amount of dice per wafer, while maintaining high throughput.
Advanced Inspection Solutions for High Brightness LED
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Condor 300 ensures that bumps, gold bumps, micro bumps and TSV meet their tight dimensional tolerances and are correctly positioned as well as defect controlled.
The Eagle-AP provides both 2D and 3D inspection and metrology on the same platform, while keeping extremely high performance and throughput levels.
The Condor 203 is a versatile, fully automated, optical inspection platform for special applications such as LED, MEMS, optical and medical devices, designed to inspect framed or unframed wafers and various thickness.
The Condor 900 is the ideal choice for inspection and metrology addressing the most demanding semiconductor market applications and the emerging 3D-IC market
Designed to manage the most critical issues of LED applications inspection, Condor 5LED includes advanced software alignment functionality.