Condor PD

The CondorPD Series of automated wafer inspection systems detects dicing-related defects as well as as flaws from preceding processes. Inspection is conducted while dice are still in wafer format — the last opportunity to add essential information to the wafer map. During dicing, dice shift and rotate relative to their original location due to the stretching of the adhesive tape. The Condor’s multi-level software alignment precisely aligns each die with its reference image, ensuring reliable detection and eliminating false alarms. This capability is especially important for stretched and reconstructed wafers where die shift is more pronounced and even critical for very small dice, such as LED. In addition to dicing-related damages, the Condor inspects defects from all previous processes, such as surface contamination and scratches, bond pad damage, size and placement deviations.

Reliable detection and metrology of all dicing-related defects
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System Highlights

  • Real time die alignment for the most accurate detection of stretched and reconstructed wafers
  • Simultaneous detection of die active area and street
  • Auto defect classification
  • Die boundary violation (chip in/out)
  • Oversize die
  • Micro cracks
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