Eagle-AP

Designed for the Advanced Packaging Market

The Eagle Product Family is designed to support the semiconductor industry from R&D to the high production volume environment.

The Eagle-AP provides both 2D and 3D inspection and metrology on the same platform, while keeping extremely high performance and throughput levels.

  • Next generation bumps down to 2um
  • Ultra high number of bumps measurement per wafer (50 million)
  • Bump CD and surface detection
  • RDL CD and height measurement
  • TSV post-via-fill protrusions (nails)
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System Highlights

  • Combined 2D&3D capabilities in same scan
  • A new robust platform that enables high TPT & accuracy
  • High resolution optics
  • Advanced image processing & algorithms
  • Flexible Software
  • Multiple handling options for bare and framed wafers
For additional information on our products, please contact us.
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