Eagle-i

The Eagle Product Family is designed to support the semiconductor industry from R&D to the high production volume environment.

Eagle-i is the most advanced system for 2D surface defect inspection and metrology

High volume production 2D inspection solutions for:

Pre & post bumped wafers
Probe Mark Inspection
OQC
Post dicing
Reconstructed wafers

Unique solutions for:

CMOS Image Sensor -Advanced solutions for the smallest pixels
MEMS - Meeting your special application requirements
LED -Yield improvement solutions

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System Highlights

Combined 2D&3D capabilities in same scan
A new robust platform that enables high TPT & accuracy
High resolution optics
Image processing & algorithms
Flexible Software
Multiple handling options for bare and framed wafers

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Eagle-i s the most advanced system for 2D surface defect inspection and metrology, delivering High volume production 2D inspection solutions for Pre and post-bumped wafers, Probe Mark Inspection, OQc and more.