EagleT-AP

Designed for the Advanced Packaging market, the EagleT-AP provides both 2D and 3D inspection and metrology on the same platform,while keeping extremely high performance and throughput levels.

The system provides leading inspection and metrology capabilities empowered by:

Genesis detection engine
New camera
New high-end optic channel
Special LED illumination
CAD based detection
Cutting edge processing power
Next generation bumps down to 2um
Ultra high number of bumps measurement per wafer (50 million)
Bump CD and surface detection
RDL CD and height measurement

> TSV post-via-ll protrusions (nails)The EagleT-AP provides both 2D and 3D inspection and metrology on the same platform,

while keeping extremely high performance and throughput levels:

> Genesis detection engine

> New camera

> New high-end optic channel

> Special LED illumination

> CAD based detection

> Cutting edge processing power

> Next generation bumps down to 2um

> Ultra high number of bumps measurement per wafer (50 million)

> Bump CD and surface detection

> RDL CD and height measurement

> TSV post-via-ll protrusions (nails)EagleT-AP provides both 2D and 3D inspection and metrology on the same platform,

while keeping extremely high performance and throughput levels:

> Genesis detection engine

> New camera

> New high-end optic channel

> Special LED illumination

> CAD based detection

> Cutting edge processing power

> Next generation bumps down to 2um

> Ultra high number of bumps measurement per wafer (50 million)

> Bump CD and surface detection

> RDL CD and height measurement

> TSV post-via-ll protrusions (nails)

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Product Highlights

Metrology for all bump types, including Solder, gold, lead-free, pillar, copper, micro bumps and nails
3D metrology capabilities include analysis of bump height, co planarity PR/PI thickness and via opening depth
2D metrology capabiloities include analysis of diameter, width, length, placement deviations, overlay and die shift

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