Camtek flexible platform utilizes wide variety of technologies addressing the complex steps of the 3DIC development and production needs.
Our fully automated 2D and 3D metrology and defect detection capabilities cover the most advanced industry requirements addressing industry roadmap.
The system includes data analysis tools enable process monitoring and yield enhancement.
Capabilities• High volume Full Wafer Bump 2D and 3D inspection and metrology
• Layer thickness measurement
• Alignment between layers
• Overlay measurements
• High resolution CD measurements
• Surface related defect inspection
• TSV CD measurement
• Post via filled inspection
• Via reveal/nails height and co-planarity measurements
• RDL Inspection & Metrology
Technologies• Camtek unique white light triangulation sensor
• Advanced processing engines for defect inspection and metrology
• High resolution 3D confocal sensor
• Light interferometry technology for 3D
The Eagle-AP provides both 2D and 3D inspection and metrology on the same platform, while keeping extremely high performance and throughput levels.
Designed for the Advanced Packaging market, the EagleT-AP provides both 2D and 3D inspection and metrology on the same platform,while keeping extremely high performance and throughput levels.