Bump Inspection & Metrology
Camtek combined 2D and 3D inspection and metrology platform is the industry standard for high volume production of the Advanced Packaging market.
Camtek systems are used by all the major Advanced Packaging manufacturers for the most challenging applications positioning us as a technology and market leader.
Our inspection and metrology systems can measure bumps down to 2um and up to 50 million bumps per wafer (100% defect detection and metrology).
Capabilities• High volume Full Wafer Bump 2D and 3D inspection and metrology
• Bump CD measurement
• General surface inspection
• RDL Inspection & Metrology
• FAB Automation support (SECS/GEM)
Technologies• Camtek unique white light triangulation sensor
• Advanced processing engines for defect inspection and metrology
• High resolution 3D confocal sensor
• Camtek Light interferometry technology for 3D (CLIP)
The Eagle-AP provides both 2D and 3D inspection and metrology on the same platform, while keeping extremely high performance and throughput levels.
Designed for the Advanced Packaging market, the EagleT-AP provides both 2D and 3D inspection and metrology on the same platform,while keeping extremely high performance and throughput levels.