EagleT-AP

Designed for the Advanced Packaging market, the EagleT-AP provides both 2D and 3D inspection and metrology on the same platform,while keeping extremely high performance and throughput levels.
 
The system provides leading inspection and metrology capabilities empowered by:
  • Genesis detection engine
  • New camera
  • New high-end optic channel
  • Special LED illumination
  • CAD based detection
  • Cutting edge processing power
  • Next generation bumps down to 2um
  • Ultra high number of bumps measurement per wafer (50 million)
  • Bump CD and surface detection
  • RDL CD and height measurement
> TSV post-via-ll protrusions (nails)The EagleT-AP provides both 2D and 3D inspection and metrology on the same platform,
while keeping extremely high performance and throughput levels:
> Genesis detection engine
> New camera
> New high-end optic channel
> Special LED illumination
> CAD based detection
> Cutting edge processing power
> Next generation bumps down to 2um
> Ultra high number of bumps measurement per wafer (50 million)
> Bump CD and surface detection
> RDL CD and height measurement
> TSV post-via-ll protrusions (nails)EagleT-AP provides both 2D and 3D inspection and metrology on the same platform,
while keeping extremely high performance and throughput levels:
> Genesis detection engine
> New camera
> New high-end optic channel
> Special LED illumination
> CAD based detection
> Cutting edge processing power
> Next generation bumps down to 2um
> Ultra high number of bumps measurement per wafer (50 million)
> Bump CD and surface detection
> RDL CD and height measurement
> TSV post-via-ll protrusions (nails)
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Product Highlights

  • Metrology for all bump types, including Solder, gold, lead-free, pillar, copper, micro bumps and nails
  • 3D metrology capabilities include analysis of bump height, co planarity PR/PI thickness and via opening depth
  • 2D metrology capabiloities include analysis of diameter, width, length, placement deviations, overlay and die shift

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