Post Dicing

Camtek offers dedicated inspection and metrology capabilities for dicing-related process.
Combined with detection abilities of previous process steps, the Eagle-i is a powerful tool for the end product quality.

The Eagle-i multi-level software alignment precisely aligns each die with its reference, ensuring reliable detection for diced, stretched and reconstructed wafers.
A variety handling configurations covers various wafer sizes and types.
Our quick setup is in line with the demanding high volume production environment.

Capabilities

• Kerf metrology and inspection (chip in/out)
• Die boundary violation
• Oversize die
• Micro cracks
• Real time die alignment
• Simultaneous detection of die active area and street

Technologies

• Advanced processing engines for defect inspection and metrology
• High resolution 3D confocal sensor


Products

Eagle-i

Eagle-i s the most advanced system for 2D surface defect inspection and metrology, delivering High volume production 2D inspection solutions for Pre and post-bumped wafers, Probe Mark Inspection, OQc and more.