![]() Post Dicing
Camtek offers dedicated inspection and metrology capabilities for dicing-related process.
Combined with detection abilities of previous process steps, the Eagle-i is a powerful tool for the end product quality. The Eagle-i multi-level software alignment precisely aligns each die with its reference, ensuring reliable detection for diced, stretched and reconstructed wafers. A variety handling configurations covers various wafer sizes and types. Our quick setup is in line with the demanding high volume production environment. Capabilities• Kerf metrology and inspection (chip in/out)• Die boundary violation • Oversize die • Micro cracks • Real time die alignment • Simultaneous detection of die active area and street Technologies• Advanced processing engines for defect inspection and metrology• High resolution 3D confocal sensor Products![]() Eagle-iEagle-i s the most advanced system for 2D surface defect inspection and metrology, delivering High volume production 2D inspection solutions for Pre and post-bumped wafers, Probe Mark Inspection, OQc and more. |