Fostering innovation

Camtek Light interferometry technology for 3D (CLIP)

Camtek’s Light Interferometry Profiler enables fast sampling, high accuracy, sub-micron height and depth measurement. CLIP provides easy and fast metrology of micro bumps, RDLs, laser-dicing trenches, Through-Silicon-Via (TSV), contact pads, gold bumps, probe marks and any other 3D elements on the die.

Highlights

  • Sub-micron accuracy
  • Fast frame grab speed
  • Two Illumination options
  • 3D frame grabbing for topography analysis

Products

Eagleᵀ-AP

2D and 3D metrology and inspection  on the same platform

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EagleT-i

Superior detection

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EagleT-i Plus

Superior detection

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