Fostering innovation

Layer Thickness Measurement

Thin layers applied in various packaging process steps require special metrology to assure layer’s uniformity and quality. Camtek’s proprietary layer thickness sensor provides sub-micron measurement capabilities enabling the light interferences to bounce back from the coated surface thus retrieving the layer’s coating thickness.

Highlights

  • Thin layers metrology applied during packaging process steps
  • Sub-micron and multi-layer thickness metrology
  • Can be implemented in both development and high volume manufacturing environments

Products

Eagleᵀ-AP

2D and 3D metrology and inspection  on the same platform

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EagleT-i

Superior detection

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EagleT-i Plus

Superior detection

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