RDL

Unique solutions for multi-layer RDL

Process variation, smaller dimensions and multi-layer redistribution layers (RDLs) make inspection and metrology requirements challenging.

Camtek has developed a unique imaging solution to cope with multi-transparent organic layers, dramatically improving top layer image by suppressing the underlayers. Our Clear Sight Illumination Illumination (CSI) technology improves detection of cuts and shorts and significantly reduces overkill defects from layers below.

Capabilities

  • RDL inspection and metrology
  • Inspection of multi-layer RDL
  • Multiple optics settings
  • 3D height and co-planarity measurement
  • CAD based detection

Technologies

  • Clear Sight Imaging
  • Camtek unique white light triangulation sensor (8th generation)
  • Advanced processing engines for defect inspection and metrology
  • High-resolution 3D confocal sensor
  • Light interferometry technology for 3D
  • CAD based detection

Products

Eagle G5

the Eagle G5 is engineered to deliver unmatched speed and efficiency

Learn More >

Eagleᵀ-i

Superior detection

Learn More >

Eagleᵀ-i Plus

Superior detection

Learn More >

MicroProf® AP

Flexible multi-sensor metrology tool for advanced packaging

Learn More >

MicroProf® DI

High-precision optical surface inspection for semiconductor applications

Learn More >

MicroProf® FS

Multi-sensor technology and hybrid metrology for MEMS and foundries

Learn More >

MicroProf® PT

Panel Metrology and Inspection Tool for Advanced Semiconductor Packaging

Learn More >

MicroProf® MHU

Material Handling Unit with dual-arm robot for the semiconductor, MEMS, and LED industries

Learn More >

MicroProf® 200

Universal, stand-alone metrology tool

Learn More >

MicroProf® 300

Powerful metrology tool for quality assurance, development and manufacturing

Learn More >
Back to Markets