Products
Eagleᵀ-AP Plus
Designed for the Advanced Packaging market, the Eagleᵀ-AP Plus provides unparalleled metrology capabilities, while keeping extremely high performance and throughput levels.
- Over 60 million bumps per wafer
- 100% bump height measurement
- Bump range: 2-250μm
- CD/Overlay of any object type and size
- True die shift position
- EBR metrology
- Auto setup/calibration
- Ultra high throughput configurations
- Height and depth profiling
- Layer thickness
Capabilities
- Measurement of bump height, co-planarity, PR/PI thickness with via opening depth and surface-to-surface metrology
- Camtek Triangulation Sensor (CTS): High speed 3D scan
- Camtek Confocal Sensor (CCS): 3D high resolution profile area mapping
- Camtek Light Interferometer profiles (CLIP)
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