Products

EagleT-AP Plus

Designed for the Advanced Packaging market, the EagleT-AP Plus provides unparalleled metrology capabilities, while keeping extremely high performance and throughput levels.
  • Over  60 million bumps per wafer
  • 100% bump height measurement
  • Bump range: 2-250μm
  • CD/Overlay of any object type and size
  • True die shift position
  • EBR metrology
  • Auto setup/calibration
  • Ultra high throughput configurations
  • Height and depth profiling
  • Layer thickness

Capabilities

  • Measurement of bump height, co-planarity, PR/PI thickness with via opening depth and surface-to-surface metrology
  • Camtek Triangulation Sensor (CTS): High speed 3D scan
  • Camtek Confocal Sensor (CCS): 3D high resolution profile area mapping
  • Camtek Light Interferometer profiles (CLIP)

Related Products

Eagleᵀ-AP

2D and 3D metrology and inspection  on the same platform

Learn More >

EagleT-i

Superior detection

Learn More >

EagleT-i Plus

Superior detection

Learn More >
Back to Products