Fan-out Wafer Level Packaging (FOWLP) is one of the latest packaging trends in microelectronics.
Designed mainly for Fanout Panel-Level-Package (FO-PLP) applications, Camtek’s Golden Eagle is used for the inspection and metrology of standard panel sizes, up to 650mm x 650mm. The Golden Eagle addresses the challenges of FOWLP while providing a robust system that addresses the most stringent, high-volume manufacturing requirements.
- Supporting panel size – up to 650X650mm
- RDL inspection for Fan-out applications
- Dedicated algorithms for superior detection
- High-end optic channel
- Time delay and integration camera
- Special LED illumination
- Cutting edge processing power
- Computer Aided Design (CAD)-based detection