Fan-out Wafer Level Packaging (FOWLP) is one of the latest packaging trends in microelectronics.

Designed mainly for Fanout Panel-Level-Package (FO-PLP) applications, Camtek’s Golden Eagle is used for the inspection and metrology of standard panel sizes, up to 650mm x 650mm. The Golden Eagle addresses the challenges of FOWLP while providing a robust system that addresses the most stringent, high-volume manufacturing requirements.


  • Supporting panel size – up to 650X650mm
  • RDL inspection for Fan-out applications
  • Dedicated algorithms for superior detection
  • High-end optic channel
  • Time delay and integration camera
  • Special LED illumination
  • Cutting edge processing power
  • Computer Aided Design (CAD)-based detection


Golden Eagle

Designed for Panel inspection & metrology

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