Designed for speed and accuracy, our leading inspection capabilities address the Semiconductor market most demanding
applications, including CMOS Image Sensor, MEMS, FOWLP, WLCSP, Bumping, Memory, RF, Power and Automotive
Our comprehensive software solutions, combining machine learning and data mining capabilities, offer an open and flexible database configuration and a set of tools designed to improve production and yield by data enhancement, using manual and automatic tools and analysis capabilities.
Designed for the Advanced Packaging market, the Eagle product family provides both 2D and 3D inspection and metrology in high volume production environments, providing metrology solutions for: FOWLP, WLCSP, Bumping, 3DIC, 2.5D and Memory Cube.
