Post Dicing

Camtek offers dedicated inspection and metrology solutions for dicing-related processes, ensuring the reliability of the end product.

Camtek developed new capabilities to address new dicing technologies such as Stealth and Plasma dicing
Side wall cracks are killer defects. However, the detection of these cracks has been historically challenging. Camtek has developed a unique technology for the detection of side wall cracks. In the emerging advanced packaging market, the detection of these cracks in the early process stages is crucial for a defect-free end product, saving the whole manufacturing chain undesirably high costs.

Our Eagle-i multi-level software alignment capability precisely aligns each die with its reference, ensuring reliable detection for diced, stretched and reconstructed wafers. Camtek provides a variety of handling configurations that cover various wafer sizes and types and a quick setup, in line with the demanding high-volume manufacturing environment.

• Detection of down to sub-micron surface defects
• Detection of down to sub-micron chipping defects
• Dedicated algorithm for chipping inspection to ensure die integrity
• Kerf metrology and inspection, both chip in and out
• Die boundary violation
• Oversize die
• Micro cracks
• Real time die alignment
• Simultaneous detection of die active area and street

• Advanced processing engines for defect inspection and metrology
• Inner Crack Imaging (ICI)
• Back light illumination
• High-resolution inspection channel