Markets & Applications
Our Markets
Advanced Packaging
With years of experience in the advanced packaging market and partnerships with the world’s leading manufacturers, Camtek’s combined 2D and 3D inspection and metrology platform is the industry standard for sampling and high-volume production environments.
Bump & Copper Pillar
Camtek Eagle-AP is the industry standard for high-volume production of 2D and 3D metrology systems, as well as a leader in inspection technology for bumps and copper pillars.
RDL
Unique imaging solution for multi-transparent organic layers improves detection of cuts and shorts and significantly reduces overkill defects from layers below.
Fan-out
Camtek’s technology provides dedicated inspection and metrology capabilities that address the challenging fan-out process and specifically enable our systems to inspect wafers with RDLs of 2-micron line/space.
Heterogenous Integration
Camtek’s flexible inspection and metrology systems utilize a wide variety of technologies to address the complex needs of 3D integrated circuit development and production.
CMOS Image Sensors
Camtek offers CMOS Image Sensor manufacturers systems for a high-volume manufacturing environment with uncompromising detection ability.
Power
Camtek’s high-end optics and illumination channels support the power device manufacturing industry by enabling the detection of small defects at high resolution.
BEOL of the Front-end Inspection
With geometries getting smaller, macro inspection becomes both more challenging and crucial for defect-free and high-yield wafer manufacturing. The variety of defects calls for detection optimization, fast screening and categorization of the high volume manufacturing environment,
Compound Semiconductors
The compound semiconductors manufacturing process is unique and requires dedicated solutions for Inspection and Metrology. Camtek’s offering includes the inspection of Epitaxial layers, inner cracks within the Epitaxial layer, surface topography, Bow measurement, data analysis and more.
RF
Camtek offers dedicated inspection solutions to support the emerging RF manufacturing market, enabling high-volume manufacturing at high throughput.
Un-patterned Wafers
Inspection challenges of un-patterned wafers are numerous and include accurate defect position reporting, wafer warpage monitoring, 3D defect identification, shallow defect detection, wafer surface quality monitoring and fully automated data collection.
Post Dicing
Camtek offers dedicated inspection and metrology solutions for dicing-related processes, ensuring the reliability of the end product.
Post Probing Inspection
Camtek offers advanced inspection and metrology solutions to detect and measure damage caused during the wafer probing process. Our solutions were developed to address a variety of defects critical to device quality while also providing analysis to enhance production and yield.
MEMS
Our unique flexible platform supports the entire spectrum of MEMS applications. Several forms of handling configurations and special developments are available to support the various wafer sizes and types.
LED
Our LED inspection and metrology systems include a unique ability to analyze and process a huge amount of data. The systems are equipped with special optics and illumination designed specifically for the LED industry