Products
360°Scan
Designed as a modular, add-on module to both the Eagle and the Hawk platforms, 360°Scan provides simultaneous edge and bevel backside inspection capabilities.
With versatile scan modes – standalone or combined – this module enhances the system with a comprehensive, 360° scan
Highlights
- Defect inspection at the wafer’s periphery and backside to detect FM, cracks, chipping, scratches, glue residues, discoloration and process variations
- Metrology of edge width, layer centricity, trim width, edge thickness, bonding alignment
- Extensive coverage of the stacked wafer edge and bevel
- Highly warped and rigid wafers handling
- Defect sensitivity of 3µm for edge and bevel inspection and down to 1 um for backside inspection
- Fast scan time and optimized cycle time
Products
Acquire Automation XT
Easy recipe creation, multi-sensor measurement or hybrid metrology
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Mark III – Measurement Analysis SW
Process, evaluate, and present 2D or 3D measurements
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360°Scan
Designed as a modular, add-on module to both the Eagle and the Hawk platforms.
Learn More >