Products
Eagleᵀ-AP
Designed for the Advanced Packaging market, the Eagleᵀ-AP provides both 2D and 3D metrology and inspection on the same platform, while keeping extremely high performance and throughput levels.
The system provides leading inspection and metrology capabilities powered by:
- Genesis detection engine
- high-end optic channel
- Special LED illumination
- CAD based detection
- Cutting edge processing power
- Next generation bumps down to 2um
- Ultra high number of bumps measurement per wafer (50 million)
- Bump CD and surface detection
- RDL CD and height measurement
Capabilities
- Metrology for all bump types, including solder, gold, copper pillars and micro-bumps
- 3D metrology capabilities include analysis of bump height, co planarity PR/PI thickness and via opening depth
- 2D metrology capabilities include analysis of diameter, width, length, placement deviations, overlay and die shift
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