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Eagleᵀ-AP

Designed for the Advanced Packaging market, the EagleT-AP provides both 2D and 3D metrology and inspection  on the same platform, while keeping extremely high performance and throughput levels.
The system provides leading inspection and metrology capabilities powered by:
  • Genesis detection engine
  • high-end optic channel
  • Special LED illumination
  • CAD based detection
  • Cutting edge processing power
  • Next generation bumps down to 2um
  • Ultra high number of bumps measurement per wafer (50 million)
  • Bump CD and surface detection
  • RDL CD and height measurement

Capabilities

  • Metrology for all bump types, including solder, gold, copper pillars and micro-bumps
  • 3D metrology capabilities include analysis of bump height, co planarity PR/PI thickness and via opening depth
  • 2D metrology capabilities include analysis of diameter, width, length, placement deviations, overlay and die shift

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