Newsroom

CAMTEK RECEIVES ORDERS OF OVER $4 MILLION FOR MULTIPLE SYSTEMS FROM A TOP SEMICONDUCTOR FOUNDRY

 

For Fan-Out Wafer-Level Packaging Application; expecting additional orders in December

MIGDAL HAEMEK, Israel – November 23, 2015– Camtek Ltd. (NASDAQ and TASE: CAMT), today announced that one of the world’s leading Semiconductor foundries placed multiple orderstotaling over $4 million for inspection and metrology systems to be installed in the fourth quarter of 2015. Further additional orders are expected in December for delivery in the first quarter of 2016.

The equipment will be used for the inspection and metrology of various applications, including Fan-Out and other solutions for  advanced packaging markets.

Ramy Langer, Vice President and Head of Camtek's Semiconductor Division, commented, “Camtek has long standing relationships with industry leaders and a very significant install base worldwide. This order from one of the top semiconductor manufacturers, positions our Eagle product family as the tool of choice for critical inspection steps in a demanding Advanced Packaging application.”

Continued Mr. Langer: “The strong demand in the Advanced Packaging segment is driven by the latest generation of ultra-thin mobile devices such as smartphones and tablets, looking to maximize space and power efficiencies. Camtek’s expertise in metrology and inspection in this market segment together with our increasing market share supports our projections for continuous growth in the Semiconductor Division for the remainder of this year and beyond.”

 

ABOUT CAMTEK LTD.

Camtek Ltd. provides automated and technologically advanced solutions dedicated to enhancing production processes, increasing products yield and reliability, enabling and supporting customer’s latest technologies in the Semiconductors, Printed Circuit Boards (PCB) and IC Substrates industries.

Camtek addresses the specific needs of these interconnected industries with dedicated solutions based on a wide and advanced platform of technologies including intelligent imaging, image processing and functional 3D inkjet printing.