CAMTEK ANNOUNCES CLOSING OF THE ACQUISITION OF SELA – Semiconductor Engineering Laboratories LTD.

MIGDAL HAEMEK, Israel – November 12, 2009 – Camtek Ltd. (NASDAQ and TASE: CAMT), today announced that further to its
announcement on September 24, 2009, regarding the signing of an agreement for the acquisition of the entire share capital of
SELA – Semiconductor Engineering Laboratories Ltd. (“SELA”), it has completed the acquisition of Sela.

In consideration for the shares, Camtek will pay to SELA’s shareholders future payments in the aggregate amount of up to
$9.5 million, contingent upon SELA’s revenues.

SELA is engaged in the development, manufacturing and marketing of automated SEM (Scanning Electron Microscope) and TEM
(Transmission Electron Microscope) sample preparation equipment, primarily for the semiconductor industry. SELA has more than 275 systems installed worldwide, many of which are located at world-leading semiconductor fabrication facilities.
SELA recently introduced the Xact, the first TEM/STEM sample preparation system using Adaptive Ion Milling (AIM) technology.
The AIM technology brings numerous advantages to traditional FIB (Focused Ion Beam) technology by reducing the sample
thickness to below 30nm over a large area with high precision and throughput and with superior image quality.
“SELA is a significant addition to our technological assets, and we are eager to leverage Camtek’s global infrastructure,
sales and support teams, manufacturing and facilities, to continue to service SELA’s existing customer base, while targeting
new customers. Sela will function as a Business Division within Camtek, led by Mr. Colin Smith, formerly SELA’s CEO and
President, who will assume the position of VP at Camtek and Sela Division manager” commented Rafi Amit, Camtek’s CEO.

ABOUT CAMTEK LTD.
With headquarters in Migdal Ha’Emek Israel, Camtek Ltd., designs, develops, manufactures, and markets automatic optical
inspection systems and related products.  Camtek’s automatic inspection systems are used to enhance both production processes and yield for manufacturers in the printed circuit board industry, the high density interconnect substrate industry and the semiconductor manufacturing and packaging industry. This press release is available at www.camtek.co.il.

This press release may contain projections or other forward-looking [state]ments regarding future events or the future
performance of the Company. These [state]ments are only predictions and may change as time passes. We do not assume any
obligation to update that information. Actual events or results may differ materially from those projected, including as a
result of changing industry and market trends, reduced demand for our products, the timely development of our new products
and their adoption by the market, increased competition in the industry, price reductions as well as due to risks identified
in the documents filed by the Company with the SEC.

CONTACT INFORMATION
CAMTEK:
Mira Rosenzweig, CFO
Tel: +972-4-604-8308
Fax:+972-4-604-8300
[email protected]

IR INTERNATIONAL:
Ehud Helft / Kenny Green
GK Investor Relations
Tel: (US) 1 646 201 9246
[email protected]