Camtek Extends its Leadership in 3DIC with Repeat Orders from a Leading Asian Foundry


MIGDAL HAEMEK, IsraelMay 26, 2011 – Camtek Ltd. (NASDAQ and TASE: CAMT) ("Camtek"), today announced that it has received repeat orders for Automatic Optical Inspection (AOI) systems.  The application is advanced Micro Bump inspection and metrology from a leading foundry based in Asia. The systems will be installed during the second and third quarter of 2011.

Advanced Micro Bump and Through-Silicon-Via technology combine vertical stacking of integrated circuits. This enables "more than Moore" end-product performance, lower power consumption, a smaller footprint and reduced overall cost. Camtek’s AOI provides a complete solution allowing a combination of high performance 2D and 3D metrology and inspection capabilities on the same platform.

"The technology of 3D integrated circuits (3DIC), is trending to advanced micro bumps of below 10 mm and may reach up to 1 million bumps per die. With this technology trend, there are significant challenges in the measurement of the small bumps, including the efficient handling of huge amounts of data" commented Roy Porat, Camtek’s CEO. "The 3DIC technology is a significant driver in our market, and we are very pleased with the fact that we are the tool of choice in the selection by this very important customer.  I believe that we will see further orders from this customer in the future."



Camtek Ltd provides automated solutions dedicated for enhancing production processes and yield, enabling our customers new technologies in two industries; Semiconductors, Printed Circuit Board (PCB) & IC Substrates.

Camtek addresses the specific needs of these industries with dedicated solutions based on a wide and advanced platform of technologies including intelligent imaging, image processing, ion milling and digital material deposition. Camtek’s solutions range from micro-to-nano by applying its technologies to the industry-specific requirements.


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