Camtek Joins Industry Alliance
Camtek Joins Industry Alliance to Develop Advanced 3D Semiconductor Packaging
Camtek will be an Advanced Optical Inspection Partner in New York [state]’s Tech Valley
MIGDAL HAEMEK, Israel – June 8, 2010 – Camtek Ltd. (NASDAQ and TASE: CAMT) (“Camtek” or the “Company”), announced today that
it has entered into a joint development agreement (JDA) with IBM Corporation (NYSE: IBM) and will be joining a new industry
alliance aimed at optimizing systems and processes for next-generation three-dimensional (3D) semiconductor packaging.
Camtek has a significant role in providing advanced optical inspection and metrology R&D expertise for the new development
Following the semiconductor front-end model, the new IBM-led R&D collaboration is bringing together a world-class ecosystem
of companies to focus specifically on packaging development. The joint development effort is leveraging the joint resources
of key manufacturers, suppliers and customers, and it will create leading-edge packaging centers to develop end-to-end
3D packaging solutions for the industry — establishing a host of new best-known-methods for the semiconductor back-end.
The work will be centered in New York’s Tech Valley – a region in Eastern New York [state] that stretches from Montreal to
just north of New York City – and is one of the world’s leading epicenter’s for nanotechnology R&D.
The new generation of 3D packaging will utilize multiple stacked semiconductor layers with vertical connections between them.
Compared to 2D devices, the new 3D devices will enable higher performance with lower power consumption, as well as greater bandwidth and the integration of mixed technologies.
To be successful, these complex next-generation 3D packages will require more advanced defect detection abilities and more
advanced metrology tools. To address that critical need, Camtek’s new automated optical inspection (AOI) system, will be used
in the joint development collaboration, to meet the challenge. The Camtek tool will be delivered in the second quarter of
"We are extremely gratified that Camtek is now an inspection partner in the IBM-led semiconductor packaging R&D ecosystem,”
said Roy Porat, Camtek’s General Manager. "We’re looking forward to contributing our inspection experience to this
prestigious industry group and we hope to build significant R&D competencies by helping bring advanced packaging to the next
ABOUT CAMTEK LTD.
Camtek Ltd provides automated solutions dedicated for enhancing production processes and yield, enabling our customers new
technologies in two industries; Semiconductors, Printed Circuit Board (PCB) & IC Substrates.
Camtek addresses the specific needs of these industries with dedicated solutions based on a wide and advanced platform of
technologies including intelligent imaging, image processing, ion milling and digital material deposition. Camtek’s solutions
range from micro-to-nano by applying its technologies to the industry-specific requirements.
This press release is available at www.camtek.co.il.
This press release may contain projections or other forward-looking [state]ments regarding future events or the future
performance of the Company. These [state]ments are only predictions and may change as time passes. We do not assume any
obligation to update that information. Actual events or results may differ materially from those projected, including as a
result of changing industry and market trends, reduced demand for our products, the timely development of our new products
and their adoption by the market, increased competition in the industry, price reductions as well as due to risks identified
in the documents filed by the Company with the SEC.
Mira Rosenzweig, CFO
INTERNATIONAL INVESTOR RELATIONS
CCG Investor Relations
Ehud Helft / Kenny Green
Tel: (US) 1 646 201 9246