Camtek Receives Order for 28 Systems from a tier-1 manufacturer for High Bandwidth Memory (HBM) and Heterogenous Integration (HI) Applications

Since the beginning of the third quarter to-date, Camtek has received orders for 240 systems

MIGDAL HAEMEK, Israel – November 13, 2023 – Camtek Ltd. (NASDAQ: CAMT; TASE: CAMT), today announced that it has received a new order for 28 systems from a tier-1 manufacturer, for the inspection & metrology of High Bandwidth Memory (HBM) and Heterogenous Integration (HI) applications. This order adds to the already strong backlog of systems that are expected to be delivered during 2024.

HBM is a critical component in chips enabling high-speed data processing in applications ranging from artificial intelligence and gaming to data centers.

HI is a new technology which can lead to higher overall chip performance, energy efficiency and reduced footprint, by enabling the integration of various components such as processors, memory and sensors, all into a single package.

Camtek’s state-of-the-art inspection and metrology systems play a pivotal role in ensuring the quality, reliability and performance of the chip leveraging today’s newest chip fabrication technologies.

Rafi Amit, CEO of Camtek commented, “Our strong momentum continues into the fourth quarter of 2023, with the receipt of this significant 28 system order from a leading tier-1 manufacturer.  Since the beginning of the third quarter we have received orders for 240 systems which solidifies our expectations of a strong year and record 2024 for Camtek.”