Camtek Receives Orders for 42 Systems from Tier-1 Manufacturers for Heterogeneous Integration, HBM and Fan-out Applications
Order momentum increases expectations for a stronger second half of 2023
MIGDAL HAEMEK, Israel – July 13, 2023 – Camtek Ltd. (NASDAQ: CAMT; TASE: CAMT), today announced that, it has recently received orders for 42 systems from several tier-1 semiconductor manufacturers. A significant portion of the orders are for the manufacture of chiplet modules and High Bandwidth Memory (HBM) for heterogeneous integration. The systems are expected to be delivered during the second half of 2023.
Chiplet modules have emerged as critical components in enhancing computing power. Applications include artificial intelligence (AI), data center processing and gaming. The integration of chiplets with several HBM modules result in processing units (CPU/GPU) with superior performance.
These new orders underscore Camtek’s strong position as a preferred supplier of inspection and metrology systems in the rapidly expanding market of heterogenous integration.
“We are excited to have secured these significant orders from top-tier semiconductor manufacturers which increase our expectations for a stronger second half of 2023” commented Mr. Rafi Amit, CEO of Camtek. “We expect that the trend of growing demand for increased computing power, supporting AI and data centers will continue, and will lead to increasing capacity of chiplet modules and HBM for heterogeneous integration. Given the trend, we anticipate receiving further orders for similar applications in the near future.”