Products
Hawk
Developed on an innovative platform, the Hawk is designed for cutting edge advanced packaging: Chiplets, HBM and Hybrid Bonding.
The Hawk product line is a result of many years of dedicated research and development.
The Hawk is tailored to meet the growing demands for inspection and metrology, from R&D to high-volume production.
Highlights
- Down to 0.1um defect sensitivity
- x2 higher TPT compared to Eagle G5
- CTS Gen 9 for bump measurement: sub 10 um bumps pitch, sub 5um bumps CD
- More than 500M bumps per wafer
- IR Gen2 optics for inspection and metrology: 10 WPH @ 1um sensitivity, Defect sensitivity < 0.5um, overlay metrology repeatability < 15nm
- EDC (Enhanced Detection Capabilities) real time machine learning models to enhance the defect-of-interest detection accuracy
Products
MicroProf® 300
Powerful metrology tool for quality assurance, development and manufacturing
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Acquire Automation XT
Easy recipe creation, multi-sensor measurement or hybrid metrology
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Mark III – Measurement Analysis Software
Process, evaluate, and present 2D or 3D measurements
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MicroProf® MHU
Material Handling Unit with dual-arm robot for the semiconductor, MEMS, and LED industries
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360°Scan
Designed as a modular, add-on module to both the Eagle and the Hawk platforms.
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