Products

NanoProf®

NanoProf® is a flexible multi-sensor metrology system for advanced packaging, combining contactless optical measurement, active and passive vibration damping, and configurable wafer handling in one platform. It supports wafers up to 300 mm, delivers  fast, precise and repeatable measurements, and integrates smoothly into fab environments with automated handling and Camtek CAL3 EFEM compatibility.

Highlights

  • Fully automated handling of 300 mm wafers in FOUPs/ FOSBs, open cassettes or film frames
  • Robotic handler with end‑effector, dual load ports, wafer mapper, and pre-aligner
  • Support for a broad range of wafer types: warped (eLWB), bonded, tape-mounted, TAIKO, bare, thinned, and fan-out
  • EFEM with ISO Class 3 cleanroom conditions, optional thin-wafer handling, and ionizer bar
  • SEMI compliant FRT Acquire Automation XT software with recipe-based measurement and analysis
  • Flexible measurement and evaluation packages for structured and unstructured wafers
  • Layout wizard with GUI and pattern recognition for efficient teaching and precise alignment
  • Engineered for high TPT, fully automated workflows in a SECS/GEM integrated production environment

Products

Eagleᵀ-AP

2D and 3D metrology and inspection  on the same platform

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Eagleᵀ-i Plus

Superior detection

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Eagleᵀ-i

Superior detection

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Eagleᵀ-AP Plus

Industry standard

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Golden Eagle

Designed for Panel inspection & metrology

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MicroProf® TL

Optical metrology with programmable temperature control

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MicroProf® 300

Powerful metrology for quality assurance, development and manufacturing

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Acquire Automation XT

Easy recipe creation, multi-sensor measurement or hybrid metrology

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Mark III – Measurement Analysis SW

Process, evaluate, and present 2D or 3D measurements

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SurfaceSens

Modular optical metrology set-up for hybrid surface process control

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MicroProf® 200

Universal, stand-alone metrology tool

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MicroProf® MHU

Material Handling Unit with dual-arm robot

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MicroProf® FS

Multi-sensor technology and hybrid metrology for MEMS and foundries

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MicroProf® FE

Fully automated metrology for front-end applications

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MicroProf® AP

Flexible multi-sensor metrology tool for advanced packaging

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MicroProf® PT

Panel Metrology and Inspection Tool for Advanced Semiconductor Packaging

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Eagle G5

the Eagle G5 is engineered to deliver unmatched speed and efficiency

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Hawk

Designed  for cutting edge advanced packaging

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360°Scan

Designed as a modular, add-on module to both the Eagle and the Hawk platforms.

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NanoProf®

Flexible Multi-Sensor Metrology for Advanced Packaging

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